Microscopic testing of carbon fiber laminates with shape memory epoxy interlayer

For the first time, microscopic testing has been performed on shape memory polymer composites (SMPCs) which were manufactured by commercial materials already used in aerospace. Results from micro-tests have been compared with those from conventional memory-recovery cycling on macro-scale. Two shape memory polymer composite (SMPC) laminates were fabricated with different shape memory (SM) interlayer: one in the form of an uncured epoxy powder and the other in the form of a thin epoxy foam. The latter, in particular has been studied to evaluate lightweight and stiff sandwich structures with SM properties. The assessment of the manufacturing process by a hot press moulding technique was assessed through micro scale analysis using SEM and MicroCT analysis. DMA analyses were carried out to understand the interaction mechanisms between raw constituents. A Vickers micro-indentation examination before and after heating was able to assess the shape recovery behaviour at the micro-scale level. A nano-instrumental indentation was used to characterise the shape memory response under different loads at elevated temperatures. Whilst an instrumented thermo-mechanical test allowed to investigate the shape memory behaviour at macro-scale level. Results allow identifying the recovery mechanisms at the micro-scale which are responsible for the shape memory performances at the macro-scale. The higher recovery ability of the SM foam is confirmed in comparison with bulk interlayers.